Overview
LTCC (Low-Temperature Co-Fired Ceramic) is an advanced component integration technology that emerged in 1982 and has since become a mainstream solution for passive integration. It drives innovation in the passive component sector and represents a significant growth area in the electronics industry
Manufacturing Process
1.Material Preparation: Ceramic powder, glass powder, and organic binders are mixed, cast into green tapes via tape casting, and dried23.
2.Patterning: Circuit graphics are screen-printed onto the green tapes using conductive silver paste. Pre-printing laser drilling may be performed to create interlayer vias filled with conductive paste23.
3.Lamination and Sintering: Multiple patterned layers are aligned, stacked, and thermally compressed. The assembly is sintered at 850–900°C to form a monolithic 3D structure12.
4.Post-Processing: Exposed electrodes may undergo tin-lead alloy plating for solderability3.
Comparison with HTCC
HTCC (High-Temperature Co-Fired Ceramic), an earlier technology, lacks glass additives in its ceramic layers, requiring sintering at 1300–1600°C. This limits conductor materials to high-melting-point metals like tungsten or molybdenum, which exhibit inferior conductivity compared to LTCC’s silver or gold34.
Key Advantages
1.High-Frequency Performance: Low dielectric constant (ε<sub>r</sub> = 5–10) materials combined with high-conductivity silver enable high-Q, high-frequency components (10 MHz–10 GHz+), including filters, antennas, and power dividers13.
2.Integration Capability: Facilitates multilayer circuits embedding passive components (e.g., resistors, capacitors, inductors) and active devices (e.g., ICs, transistors) into compact modules, supporting System-in-Package (SiP) designs14.
3.Miniaturization: High-ε<sub>r</sub> materials (ε<sub>r</sub> >60) reduce footprint for capacitors and filters, enabling smaller form factors35.
Applications
1.Consumer Electronics: Dominates mobile phones (80%+ market share), Bluetooth modules, GPS, and WLAN devices
2.Automotive and Aerospace: Increasing adoption due to high reliability in harsh environments
3.Advanced Modules: Includes LC filters, duplexers, baluns, and RF front-end modules
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Post time: Mar-11-2025